LCS Publication Details
Publication Title: WAFER-SCALE INTEGRATION OF SYSTOLIC ARRAYS
Publication Author: Leighton, Frank T.
Additional Authors: Leiserson, Charles E.
LCS Document Number: MIT-LCS-TM-236
Publication Date: 2-1-1983
LCS Group: No Group Specified
Additional URL: No URL Given
Abstract:
VLSI technologists are fast developing wafer-scale integration. Rather than partitioning a silicon wafer into chips as is usually done, the idea behind wafer-scale integration is to asemble an entire system (or network of chips) on a single wafer, thus avoiding the costs and performance loss associated with individual packaging of chips.
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