LCS Publication Details
Publication Title: THREE-DIMENSIONAL CIRCUIT LAYOUTS
Publication Author: Leighton, Thomas
Additional Authors: Rosenberg, Arnold
LCS Document Number: MIT-LCS-TM-262
Publication Date: 6-1-1984
LCS Group: No Group Specified
Additional URL: No URL Given
Abstract:
Recent advances in fabrication technology have imminent the fabrication of multilayer chips, wafers and circuit boards. In this paper, we examine the savings in material and communication time afforded by the development of three-dimensional technology. In particular, we derive close upper and lower bounds on the volume and maximum wire length with which circuits can be realized in a multilayer medium.
To obtain this publication:

    To purchase a printed copy of this publication please contact MIT Document Services.